Full sizing and shaping capabilities for Photonics applications include Dicing, Coring, and Drilling

Multiple programmable automatic dicing saws with vision systems for pattern recognition, auto-alignment, and auto-dicing. Two of them with auto-cassette loading and in-line cleaning system for continuous dicing up to 20 wafers in 8 hours.

• Dicing on UV release tape for clean and fast dicing process, and for following auto-pick&place, auto-VI, auto-jig loading, and auto-characterizing processes.
• From the semiconductor microelectronics industry, we’ve adapted technologies to our to the needs of our optical filter component customers.
• Materials include, but not limited to fused silica (FS), BK7, ceramic glass (WMS™-15), sapphire, Silicon, and Germanium.
• Filter shape from regular square, rectangular to any polygon shape, and even circular shape (Circle-dicing) through multi-angle recipes.
• Multi-panel dicing with a single load.
• Scoring for notches, chamfers, and slots.
• Filter size from 0.5 mm to 150 mm.
• Filter thickness from 0.14 mm to 4 mm.

Two Automatic CNC systems for coring, drilling, drilling, and edging: 

• One with 5 axis and another with 3 axis
• Materials include, but not limited to BK7, FS, Sapphire, Silicon, plano optics, prisms, and beam splitters
• Coring size from 3 mm to 155 mm diameter (+/- 0.025 mm), thickness from 0.5 mm to 25.4 mm
• Drilling minimum diameter 1.5 mm (+/- 0.025 mm), thickness from 0.5 mm to 25.4 mm.
• Dicing and slotting length up to 175 mm, thickness up to 40 mm with edge perpendicularity of < 5 arcmin.
• Edging diameter up to 200 mm, thickness up to 25.4 mm
• Edge chambering up to 3 mm face width, corner chamfering > 0.5 mm face width
• Knife edging at any angle, contouring and pocketing complex geometries.