Iridian delivers precision dicing and sizing capabilities through advanced shaping technologies and tightly controlled manufacturing processes. This enables the production of optical components with highly accurate dimensions, clean edge quality, and consistent repeatability. By supporting a wide range of geometries and formats, Iridian ensures that components integrate seamlessly into complex optical assemblies. When combined with Iridian’s coating expertise, this capability provides customers with fully finished, application-ready optical solutions.

Iridian’s dicing and sizing capabilities stand out for their combination of precision, flexibility, and scalability:
• High-precision shaping technologies – State-of-the-art equipment enables tight dimensional tolerances and exceptional edge quality.
• Wide range of geometries and formats – Capability to produce components in diverse shapes, sizes, and edge profiles to meet application-specific requirements.
• Consistent performance and repeatability – Controlled processes ensure uniformity across prototypes and high-volume production.
• Seamless system integration – Accurate sizing and edge finishing support reliable assembly into demanding optical systems.
• Scalable manufacturing capacity – Processes designed to support both development programs and high-volume OEM production.
• Complementary to coating expertise – Integrated with advanced coating capabilities to deliver complete, ready-to-use optical components.

Together, these capabilities enable Iridian to provide precisely finished optical components that meet stringent mechanical and optical requirements, while simplifying supply chains and improving overall system performance.

Full sizing and shaping capabilities for Photonics applications include Dicing, Coring, and Drilling

Multiple programmable automatic dicing saws with vision systems for pattern recognition, auto-alignment, and auto-dicing. Two of them with auto-cassette loading and in-line cleaning system for continuous dicing up to 20 wafers in 8 hours.

• Dicing on UV release tape for clean and fast dicing process, and for following auto-pick&place, auto-VI, auto-jig loading, and auto-characterizing processes.
• From the semiconductor microelectronics industry, we’ve adapted technologies to our to the needs of our optical filter component customers.
• Materials include, but not limited to fused silica (FS), BK7, ceramic glass (WMS™-15), sapphire, Silicon, and Germanium.
• Filter shape from regular square, rectangular to any polygon shape, and even circular shape (Circle-dicing) through multi-angle recipes.
• Multi-panel dicing with a single load.
• Scoring for notches, chamfers, and slots.
• Filter size from 0.5 mm to 150 mm.
• Filter thickness from 0.14 mm to 4 mm.

Two Automatic CNC systems for coring, drilling, drilling, and edging: 

• One with 5 axis and another with 3 axis
• Materials include, but not limited to BK7, FS, Sapphire, Silicon, plano optics, prisms, and beam splitters
• Coring size from 3 mm to 155 mm diameter (+/- 0.025 mm), thickness from 0.5 mm to 25.4 mm
• Drilling minimum diameter 1.5 mm (+/- 0.025 mm), thickness from 0.5 mm to 25.4 mm.
• Dicing and slotting length up to 175 mm, thickness up to 40 mm with edge perpendicularity of < 5 arcmin.
• Edging diameter up to 200 mm, thickness up to 25.4 mm
• Edge chambering up to 3 mm face width, corner chamfering > 0.5 mm face width
• Knife edging at any angle, contouring and pocketing complex geometries.